热 - 散热器
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- ABB Embedded Power (15)
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- Advanced Thermal Solutions, Inc. (109477)
- AMEC Thermasol (7)
- ASSMANN WSW Components (169)
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- Cooling Source (81)
- CTS Corporation (529)
- CUI Devices (173)
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- Sarnikon (257)
- Seeed (24)
- Sunon (10)
- T-Global Technology (132)
- TechNexion (1)
- Trenz Electronic (9)
- Vicor (22)
- Wakefield Thermal (1127)
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113,405 条记录
| 图片 | 型号 | 品牌 | 描述 | 库存 | 操作 | |
|---|---|---|---|---|---|---|
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Wakefield Thermal | 11.578" WIDE X 12" FLA... |
33
In-stock
|
提交询价 | ||
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|
Wakefield Thermal | 3.375" X 12" H STYLE H... |
52
In-stock
|
提交询价 | ||
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Wakefield Thermal | HEATSINK FOR PWR... |
27
In-stock
|
提交询价 | ||
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|
Wakefield Thermal | 12.203" WIDE X 12" FLA... |
41
In-stock
|
提交询价 | ||
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|
Wakefield Thermal | 11.42" WIDE X 36" FLAT... |
26
In-stock
|
提交询价 | ||
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CUI Devices | HEAT SINK, EXTRUS... |
3,000
In-stock
|
提交询价 | ||
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CUI Devices | HEAT SINK, EXTRUS... |
2,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,987
In-stock
|
提交询价 | ||
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|
CUI Devices | HEAT SINK, STAMPI... |
2,355
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,657
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,957
In-stock
|
提交询价 | ||
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|
CUI Devices | HEAT SINK, BGA,25 X... |
1,358
In-stock
|
提交询价 | ||
|
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ASSMANN WSW Components | CPU HEATSINK, CRO... |
1,713
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
3,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,577
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,713
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,870
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,500
In-stock
|
提交询价 | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1,312
In-stock
|
提交询价 | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
2,562
In-stock
|
提交询价 |
