热 - 散热器

Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
已选条件:
113,405 条记录
图片 型号 品牌 描述 库存 操作
HSS24-B20-NP CUI Devices
HEAT SINK, STAMPI...
RFQ
2,992
In-stock
提交询价
HSS11-B20-P38 CUI Devices
HEAT SINK, STAMPI...
RFQ
2,215
In-stock
提交询价
HSS15-B20-P40 CUI Devices
HEAT SINK, STAMPI...
RFQ
4,828
In-stock
提交询价
ATS-PCB1019 Advanced Thermal Solutions, Inc.
HEATSINK TO-218/TO...
RFQ
1,341
In-stock
提交询价
HSB26-343408 CUI Devices
HEAT SINK, BGA, 33....
RFQ
1,194
In-stock
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NTE402 NTE Electronics, Inc.
HEAT SINK-PLAST. ...
RFQ
172
In-stock
提交询价
HSS02-B20-P318 CUI Devices
HEAT SINK, STAMPI...
RFQ
1,606
In-stock
提交询价
V2277E1 ASSMANN WSW Components
CPU HEATSINK, CRO...
RFQ
1,334
In-stock
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ATS-PCB1032 Advanced Thermal Solutions, Inc.
HEATSINK CLIP-ON...
RFQ
2,494
In-stock
提交询价
HSS04-B20-P318 CUI Devices
HEAT SINK, STAMPI...
RFQ
1,977
In-stock
提交询价
NTE497 NTE Electronics, Inc.
HEATSINK FOR TO-2...
RFQ
1,448
In-stock
提交询价
HSB25-282810 CUI Devices
HEAT SINK, BGA, 28....
RFQ
1,704
In-stock
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HSE01-193175 CUI Devices
HEAT SINK, EXTRUS...
RFQ
1,577
In-stock
提交询价
HSS07-C20-P274 CUI Devices
HEAT SINK, STAMPI...
RFQ
1,740
In-stock
提交询价
HSB23-232325 CUI Devices
HEAT SINK, BGA, 23 ...
RFQ
1,202
In-stock
提交询价
HSE05-171933 CUI Devices
HEAT SINK, EXTRUS...
RFQ
3,230
In-stock
提交询价
HSE02-173213 CUI Devices
HEAT SINK, EXTRUS...
RFQ
1,542
In-stock
提交询价
ATS-PCB1043 Advanced Thermal Solutions, Inc.
HEATSINK TO-3
RFQ
2,416
In-stock
提交询价
ATS-PCB1021 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 DU...
RFQ
2,323
In-stock
提交询价
NTE411 NTE Electronics, Inc.
HEAT SINK STUD-M...
RFQ
1,000
In-stock
提交询价
47 / 5671 Page, 113405 Records