HSB24-252510

制造商零件号
HSB24-252510
制造商
CUI Devices
包装/案例
-
数据表
HSB24-252510
描述
HEAT SINK, BGA,25 X 25 X 10 MM
库存
1358

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制造商 :
CUI Devices
产品分类 :
风扇,热管理 > 热 - 散热器
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
4.14W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
6.50°C/W @ 200 LFM
Thermal Resistance @ Natural :
18.10°C/W
Type :
Top Mount
数据列表
HSB24-252510

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