HSE07-753045
- Производитель-деталь №
- HSE07-753045
- Производитель
- CUI Devices
- Упаковка/футляр
- -
- Техническое описание
- HSE07-753045
- Описание
- HEAT SINK, EXTRUSION, TO-218/TO-
- lang_0071
- 992
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- * lang_0862:
- Компания:
- * Электронная почта:
- Телефон:
- Комментарий:
- lang_0872 :
- CUI Devices
- Категория товара :
- Fans, Thermal Management > Thermal - Heat Sinks
- Attachment Method :
- Clip
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218, TO-220
- Power Dissipation @ Temperature Rise :
- 15.46W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 2.10°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 4.85°C/W
- Type :
- Board Level
- lang_0258
- HSE07-753045
Продукты, связанные с производителем
Продукты, связанные с каталогом
Сопутствующие товары
| Деталь | Производитель | Склад | Описание |
|---|---|---|---|
| HSE01-193175 | CUI Devices | 1,577 | HEAT SINK, EXTRUSION, 19 X 31.5 |
| HSE01-193175P | CUI Devices | 1,582 | HEAT SINK, EXTRUSION, 19 X 31.5 |
| HSE02-173213 | CUI Devices | 1,542 | HEAT SINK, EXTRUSION, 17 X 31.9 |
| HSE02-173213P | CUI Devices | 1,572 | HEAT SINK, EXTRUSION, 17 X 31.9 |
| HSE04-251265-1 | CUI Devices | 2,713 | HEAT SINK, EXTRUSION, TO-218/TO- |
| HSE04-251265-2 | CUI Devices | 2,577 | HEAT SINK, EXTRUSION, TO-218/TO- |
| HSE05-171933 | CUI Devices | 3,230 | HEAT SINK, EXTRUSION, TO-218/TO- |
| HSE06-503045 | CUI Devices | 1,197 | HEAT SINK, EXTRUSION, TO-218/TO- |
| HSE08-505028 | CUI Devices | 1,118 | HEAT SINK, EXTRUSION, TO-218/TO- |
| HSE09-755028 | CUI Devices | 999 | HEAT SINK, EXTRUSION, TO-218/TO- |
