| HSB10-232306 |
CUI Devices |
1,287 |
HEAT SINK, BGA, 23 X 23 X 6 MM |
| HSB11-252518 |
CUI Devices |
1,433 |
HEAT SINK, BGA, 25 X 25 X 18 MM |
| HSB12-272706 |
CUI Devices |
1,713 |
HEAT SINK, BGA, 27 X 27 X 6 MM |
| HSB123JTR-E |
Intersil (Renesas Electronics Corporation) |
69,000 |
DIODE FOR HIGH SPEED SWITCHING |
| HSB123TL-E |
Intersil (Renesas Electronics Corporation) |
12,000 |
DIODE FOR HIGH SPEED SWITCHING |
| HSB123TR-E |
Intersil (Renesas Electronics Corporation) |
62,700 |
DIODE FOR HIGH SPEED SWITCHING |
| HSB124S-JTL-E |
Intersil (Renesas Electronics Corporation) |
63,000 |
DIODE FOR HIGH SPEED SWITCHING |
| HSB13-303014 |
CUI Devices |
524 |
HEAT SINK, BGA, 30.7 X 30.7 X 14 |
| HSB14-353518 |
CUI Devices |
700 |
HEAT SINK, BGA, 35 X 35 X 18 MM |
| HSB15-404010 |
CUI Devices |
35,000 |
HEAT SINK, BGA, 40 X 40 X 10 MM |
| HSB16-404018 |
CUI Devices |
1,250 |
HEAT SINK, BGA, 40 X 40 X 18 MM |
| HSB17-404025 |
CUI Devices |
35,000 |
HEAT SINK, BGA, 40 X 40 X 25 MM |
| HSB18-232310 |
CUI Devices |
5,589 |
HEAT SINK, BGA, 23 X 23 X 10 MM |
| HSB19-272718 |
CUI Devices |
239 |
HEAT SINK, BGA, 27 X 27 X 18 MM |
