TS991SNL35T4
- 制造商零件号
- TS991SNL35T4
- 制造商
- Chip Quik, Inc.
- 包装/案例
- -
- 数据表
- TS991SNL35T4
- 描述
- THERMALLY STABLE SOLDER PASTE NC
- 库存
- 35000
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- 制造商 :
- Chip Quik, Inc.
- 产品分类 :
- 焊接、拆焊、返修产品 > 焊接
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 1.23 oz (34.869g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 4
- Process :
- -
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- 数据列表
- TS991SNL35T4
制造商相关产品
目录相关产品
相关产品
| 部分 | 制造商 | 库存 | 描述 |
|---|---|---|---|
| TS991AX35T4 | Chip Quik, Inc. | 35,000 | THERMALLY STABLE SOLDER PASTE NC |
| TS991AX500T4 | Chip Quik, Inc. | 35,000 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL35T3 | Chip Quik, Inc. | 6 | THERMALLY STABLE SOLDER PASTE NC |
| TS991SNL500T3 | Chip Quik, Inc. | 20 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL500T4 | Chip Quik, Inc. | 17 | SOLDER PASTE THERMALLY STABLE NC |
